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Abstract Bachelor thesis of this manuscript is to design and build sets for the manufacture of moulds for metal Sn-58Bi type soldering test. Sn-58Bi type (Wettability) on the surface of the metal copper surface and study the influence of liquid solder type RMA: the ability to solder metal fragments using a liquid solder all RMA type 3 type: NH-100VK-1,1103 NF and NF 2107 value the ability to solder metal fragments. 3 How are the distribution ratio (Ratio Spread: Sr) unified the fragmented (Spread Factor: Sf) and a touch of solder alloy (Contact Angle: θ) Results from the study found that the liquid solder type RMA type NH-100VK-1, the average distribution ratios equal to 3.64 and the average value of a fragmented literature equal to 82.44. more of the liquid solder type RMA type NF and NF 1103 2107 and RMA type NH-100VK-1 type solder remover, soldering metal touch angle values on average equal to 14.66°, which is less than the liquid solder type RMA type NF and NF 1103 2107 from creating moulds to produce samples and tested for their ability to solder metal fragments using a liquid solder different types of RMA type. RMA type metal NH-100VK-1 suitable for Sn-58Bi-type soldering.
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