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This is a degree to write a study of influence of liquid Co RMA that affect the value of the distribution, or the ability to distribute the metal solder Sn Type - 58 copper Bi on metal surfaces.3 ways: Spread Ratio,
Spread Factor and contact angle in the initial design, and create a mold for manufacturing test pieces with metal solder leads the test pieces are to be tested with some washing-up liquid Co RMA type 3 all types of NH - 100 VK-1, NF NF 1103 and 2107
results from the study found that NH - 100 VK-1, an average value equal to 3.64 Spread Ratio Spread Factor average equal to 82.44 and that's more than NF NF 1103 and 2107 and NH - 100 VK-1, the average contact angle which is less than equal to 14.66 degrees of NF NF 1103 and 2107
It could be concluded that NH - 100 VK - 1 are well suited for metal solder Sn - 58 copper Bi on metal surfaces.
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